Jedec tray specification Specify height of TQFP component when ordering. 0 Specification or later. In general, JEDEC matrix trays look similar and have a standard outline but they are custom designed and manufactured. Specifications of JEDEC Matrix Trays. To report potential errors or make suggestions for improvement to a published JEDEC standard, please use this form. The outline dimensions of of all JEDEC matrix trays are 322. JEDEC Standard 951, once referred to as the Design Handbook, established guideline methods for obtaining - the desired dimensions and tolerancing for various classes of packages and related items. 6 x 136mm. JEDEC standard trays are strong, with minimum twist, to hold and protect its contents. 10E Feb 2025: Item 102-1029S. . Click here for website or account help. JEDEC does not accept This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation. Standards & Documents Assistance: Published JEDEC documents on this website are self-service and searchable directly from the homepage by keyword or document number. 5” x 0. 6 x 136mm). This section will be updated on a regular basis - as new packages are JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®) JESD325 Sep 2024: This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. 35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. . JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®) JESD325 Sep 2024: This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2. QFP, LQFP, TQFP JEDEC Matrix IC Trays. 95 -i- Updated 08/16 . The outline dimensions of all JEDEC matrix trays are 12. CARRIER STANDARDS (CS) Contents . Low profile trays are with thickness of 6. Low profile trays with thickness of 0. Note 3: Up to five JEDEC trays may be stacked with empty tray on top as a cover. All sizes 5mm to 40mm. Many of them are not only device specific but device manufacturer specific. JEDEC does not accept This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. Title Document # Date; DESIGN GUIDE 4. Committee(s): JC-11, JC-11. 2 JEP95 Registrations Main Page Standards & Documents Assistance: Published JEDEC documents on this website are self-service and searchable directly from the homepage by keyword or document number. 35 inches (322. Note 1: JEDEC Standard Outline 136 x 315mm (322. 35mm accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. Free download. Normal tray color is Black. 6 Jan 31, 2010 · BQFP (PQFP) Bumper QFP Tray 100 Pin 55 5 x 11 CS-002AC BQTRAY100-5x11 132 Pin 36 4 x 9 CS-002AD BQTRAY132-4x9 Optional Features: Specify max temperature: 125°C, 140°C, 150°C, 180°C when ordering. A high QFP, LQFP, TQFP Tray JEDEC Matrix IC Trays QFP, LQFP, TQFP IC Matrix Trays Conform to JEDEC Standards QFP Body Size Quantity Pockets Per Tray Matrix Row-Column JEDEC Reference Order TopLine Part Number QFP (MQFP) Tray 10 x 10mm 96 6 x 16 CS-004AA QTRAY10mm-6x16 14 x 14mm 84 6 x 14 CS-004AB QTRAY14mm-6x14 14 x 20mm 66 6 x 11 CS-004AC Future revisions of this document will also include tray and reel guidelines. Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some Semiconductor Packing Methodology - Texas Instruments Aug 18, 2023 · It is important to remember that the JEDEC tray and carrier standards control the external geometries but they do not dictate how components are located or supported. 7 x 5. The interior of the trays and carriers is where the designers must be creative, finding the best way to capture a component while allowing for all the functionality required and remaining manufactu JEDEC IC trays are strong, with minimum twist, to hold and protect its contents. In September 2000, JEDEC Standard 951 was combined with JEP95 as section 4. The objective of this publication is to promote the standardization of practices between manufacturers and distributors resulting in improved efficiency, profitability, and product quality. Committee(s): JC-40, JC-45. Note 4: Secure with 3x ESD Velcro straps or heavy duty black conductive rubber bands (4. 25-inch (6. Registration or login required. When a few, or a few hundred, JEDEC trays are needed, our RapidTray® Machined Tray Program which provides quick delivery of custom trays without tooling is a better option. 5mm with end tabs) Note 2: Standard tray color: Black conductive or dissipative molding compound ESD safe. permissible. CS-001 Metric TAB Magazine Family CS-002 Thin Matrix Tray for Handling and Shipping of PQFP CS-003 Thin Matrix Tray for Handling and Shipping of PLCC Packages CS-004 Thin Matrix Tray for Handling and Shipping of FQFP/MQFP JEDEC standard trays are strong, with minimum twist, to hold and protect its contents. RapidTray® Machined Matrix Trays follow JEDEC standard tray outlines and utilize molded tray “blanks” that are CNC machined to create custom pockets for your parts. 5”) JEDEC Publication No. 10, GENERIC SHIPPING & HANDLING MATRIX TRAY: DG-4.